View BMIS-102_5182654.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

board level shields and contacts
design engineering we can create part designs in just hours utilizing the latest pro-engineering/ autocad systems. rapid prototyping we can deliver precision made parts in just a matter of days, packaged for automated installation. automated assembly and packaging for innovations in packaging and shield assemblies, we have a dedicated in-house automation engineering department that continually develops original automation technologies. quality our quality systems ensure the best product available because they are built into the system from part design all the way through to final packaging?which is why we continually receive the highest ratings from our customer audits. speed to market from initial design through final production, we bring everything together in a quick, efficient process that delivers you the solution you need, when you need it. laird technologies is the recognized authority on board level shielding and contact applications because we focus on five key factors that lead to your success: best-in-industry part design, rapid prototyping automated assembly and packaging, built-in quality systems from design through final packaging and the responsiveness to meet your deadlines. capabilities our automated packaging allows for complex and small designs with lower installed costs.
introduction to board level shields and contacts board level shields and contacts . . . . . . . . . . . . . . . . . . . . . . 2 design engineering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 prototyped parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 packaging automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 quality?iso 9001:2000 certified . . . . . . . . . . . . . . . . . . . . . 2 standard design shields and contacts flex shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 97-2000 shields (series 97-2000) . . . . . . . . . . . . . . . . . . . . . . 4 printed circuit board shields (series 97-860, 866, 870) . . . . . 6 standard surface mount shields?one-piece and two-piece . . . 7 part no. bmis-101 and 201 . . . . . . . . . . . . . . . . . . 8 part no. BMIS-102 and 202 . . . . . . . . . . . . . . . . . . 9 part no. bmis-103 and 203 . . . . . . . . . . . . . . . . . 10 part no. bmis-104 and 204 . . . . . . . . . . . . . . . . . 11 part no. bmis-105 and 205 . . . . . . . . . . . . . . . . . 12 part no. bmis-106 and 206 . . . . . . . . . . . . . . . . . 13 part no. bmis-107 and 207 . . . . . . . . . . . . . . . . . 14 part no. bmis-210 . . . . . . . . . . . . . . . . . . . . . . . . 15 ez peel ? standard shields . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 part no. 97-2002 . . . . . . . . . . . . . . . . . . . . . . . . . 17 part no. 97-2003 . . . . . . . . . . . . . . . . . . . . . . . . . 17 part no. 97-2004 . . . . . . . . . . . . . . . . . . . . . . . . . 17 part no. 97-2005 . . . . . . . . . . . . . . . . . . . . . . . . . 17 standard precision electronic contacts . . . . . . . . . . . . . . . . . 18 part no. bmic-001 . . . . . . . . . . . . . . . . . . . . . . . 18 part no. bmic-002 . . . . . . . . . . . . . . . . . . . . . . . 18 part no. bmic-004 . . . . . . . . . . . . . . . . . . . . . . . 18 part no. bmic-006 . . . . . . . . . . . . . . . . . . . . . . . 18 part no. bmic-007-01 . . . . . . . . . . . . . . . . . . . . . 19 part no. bmic-010 . . . . . . . . . . . . . . . . . . . . . . . 19 standard prototype parts . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 custom design shields and contacts introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 one-piece shield design . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 two-piece shield design . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 ez peel ? shield design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 multi-compartmental shield design . . . . . . . . . . . . . . . . . . . 21 shield-lite ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 insulshield ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 drawn board level shields (series 97-2100) . . . . . . . . . . . . . 22 dyna-form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 custom precision electronic contacts . . . . . . . . . . . . . . . . . . 24 table of contents www.lairdtech.com 1
board level shields and contacts whether it?s a one-piece shield, multi-compartmental shield or precision contact, each solution laird technologies delivers is designed to provide maximum performance within a minimum timeline. we produce metal electronic components that are packaged for surface mount applications for a wide range of industries. laird technologies has developed expertise in a number of key areas in order to ensure that the part we provide not only performs, but also optimizes the particular application. here?s how we help you succeed: design engineering the first step in any project is determining the right board level shield or contact design for your application. based upon your specifications, our experts use the latest pro-engineering/autocad systems to develop part designs in just hours. our engineers draw on their extensive experience with application engineering, advanced design and materials engineering to solve your most complex board level shield and contact problems. however, we don?t limit our expertise to the part itself; our experienced engineers and technical specialists look beyond the component to the total application. they work with you to engineer the ideal finished product at the best value. example considerations include board layout, emi shielding requirements and grounding terminations. fast turnaround on pr ototyped parts because speed in the prototyping process is critical to production success, laird technologies has built a process to quickly respond?within days? with a prototyped part. and, because we manufacture precision parts with no allowed deviances, the part we prototype meets the tolerances of a progressive die manufacturing production environment. if design modifications are necessary, our prototype department has the flexibility to address your changes without affecting the delivery of your prototyped part. to ensure your parts deliver optimum performance and meet your specifications, all prototyped parts are 100% inspected on critical dimensions. laird technologies also provides pre-production support to help you get your production line up and running quickly. parts designed in pre-production can be supplied to you while your progressive die tools are being produced. manufacturing plants in locations throughout north america, asia and europe provide worldwide access to parts and offer the capacity to handle any size job. packaging automation for innovations in packaging and in shield assemblies, we have a dedicated in-house automation engineering department routinely developing new automation technologies. we offer a wide array of packaging options for shields and contacts, including tape and reel, tray, tube and bulk. laird technologies? tape and reel packaging allows for the lowest installed cost and is electronic industries association (eia) 481 compliant. tape sizes are supplied on 13-inch and 15-inch diameter reels. a transparent cover tape allows component verification and inspection without having to remove or handle components. two-piece shields, including multi-compartmental shields, can be packaged as either assembled or unassembled parts. our innovative automation engineering allows engineers to design small and complex contacts requiring pick-up zones of 1 mm and weighing less than 0.01 grams. our custom automation equipment places the miniature contacts into tape pockets quickly and cost effectively. the tape and reel packaged parts are now ready for installation onto printed circuit boards using standard pick-and-place equipment. we can use vision recognition marks, such as holes and tabs, to orient your parts. this eliminates an added step and leads to faster production. we also ensure each design has an adequate pick-up area for pick-and-place equipment, without sacrificing performance. quality?iso 9001:2000 certified laird technologies places a premium on quality, which is why we have received the highest ratings on major customer qualification audits and our customers continually rank us among their top suppliers for quality performance. our board level shield and contact facilities are iso 9001:2000 certified by tuv-america inc. built-in quality systems, including our proprietary 100% automated co-planarity inspection for our board level shields, ensure our rigid standards are met through all stages of operations (design, production, shipping, as well as prompt customer concern resolution). we execute real-time, automated spc on all critical dimensions throughout production. by taking these measurements, our quality assurance technicians can make necessary adjustments on the spot to ensure you receive quality parts on schedule. we maintain traceability with spc results for all jobs; captured data includes operator, shift, raw material, job number, work center and more. additionally, non-contact, automated coordinate measuring machines (cmm) are located throughout our factory floors. introduction to board level shields and contacts www.lairdtech.com 2
part number information cover: lt-bl s - l ll - w w w - c example: lt-bls-250-190-c is a cover with matching frame with a length of 2.500? and width of 1.900?. frame: l t - b l s - l l l - w w w - f - h h - p example: lt-bls-120-050-f-15-p is a frame 1.200? long by 0.050? wide with a 0.150? height. standard design shields and contacts www.lairdtech.com 3 flex shielding laird technologies provides the across the board solution to your board level shielding needs with flex shielding. all your shielding needs are identified and satisfied. flex shielding is available in a rectangular two-piece design. the frame is soldered to the grounding trace on the pcb. the ground plane of the pcb forms the bottom side of the shielding enclosure. after post-reflow inspection, the cover snaps onto the frame to complete the shielding system. access to components is a snap. if repair of components is needed, the cover can quickly be removed and replaced as required. flex shielding allows you the flexibility to specify the length and width of the board level shielding system with sizes available from 0.5" to 4.0" in 0.010" increments. whether your needs specify a 2.1" x 3.6" shield - or a 0.7" x 1.3" shield, we have them. with over 6000 sizes available rest assured all of your shielding needs will be fulfilled. available in heights ranging from 0.150" to 0.500? in increments of 0.010?. all dimensions shown in inches unless otherwise specified. length width cover length width height pin at center of all four sides. leave blank if no pins. frame our shields are made from high quality steel for excellent shielding performance across a wide frequency range. the tin plated surface provides excellent solderability and compatibility with lead-free processes. all quantities - large and small - are efficiently managed including quick delivery and no high tooling fees. drawings, 3d cad data and solder pad layout can be provided upon request. available in a wide variety of sizes from 0.5" to 4.0". available in a wide variety of heights from 0.150? to 0.500?. cover design provides retention even when severe shock and vibration are encountered. cover specially designed for easy removal and replacement. fast deliveries. competitive pricing. sizes less than 1.7 inches will not have the cross-bar feature. detail c. optional locating pin view. available for 0.5 in. - 4.00 in. sizes.
standard design shields and contacts www.lairdtech.com 4 1/2 pitch + 0.006 97-2000 shields a range of pin and pad mounting styles maximizes flexibility the 97-2000 series allow you mounting options that include various pin styles for through-hole mounting or pad styles for surface mounting. the frame material forms the walls of the enclosure, and the cover is held securely in place by spring force alone. the cover can be easily removed and replaced to provide access to the components. large or small quantities can be easily manufactured using our automated tooling, short run capabilities or photo- chemical machining operations. ^ test performance in accordance with mil-std-285 using an aperture the same size as the 1-3/4" x 2" (44.5 mm x 5.08 mm) pc shield as reference. measurement below 400 mhz were not possible because of the aperture attenuation. 97-2000 shields frame height and pin option pin style 1. figure 1. .130 to 1.000 (3,3 to 25,4) under cover height range (consult engineering for irregular hole patterns.) pitch 1/2 pitch + 0.006 97-2000 frame heights from 0.130" (3.3 mm) to 1" (25.4 mm), with other heights available upon request cover design permits retention even when severe shock or vibration are a consideration; cover was specifically designed for easy removal and replacement design allows for automated pick-and-place operations locking feature on frame guarantees corner joint stability wide variety of pin style options, including a surface mountable style. pin location can be to your customized hole location or a defined pitch frames can be hand-formed or can be supplied formed and with cover assembled a modified pin style is available for extra retention in through hole application all dimensions shown are in inches (millimeters) unless otherwise specified. through hole with standoff hole pattern layout
standard design shields and contacts www.lairdtech.com 5 pin style 3. pin style 4. figure 3. phantom lines indicate optional l-shaped configuration all dimensions shown are in inches (millimeters) unless otherwise specified. pin style 2. figure 2. .130 to 1.000 (3,3 to 25,4) under cover height range .130 to 1.000 (3,3 to 25,4) under cover height range any pitch (p) with minimum of .200 (5,08) .130 to 1.000 (3,3 to 25,4) under cover height range .130 to 1.000 (3,3 to 25,4) under cover height range surface mount tab pitch selection placement and corner locking feature through hole cover detail standard cover material thickness 0.010? (0.25 mm) tin plated phosphor bronze, in coated steel or stainless steel type on random locations flush surface mount
standard design shields and contacts www.lairdtech.com 6 all dimensions shown are in inches (millimeters) unless otherwise specified. high-performance, readily available laird technologies? standard board level shields and contacts offer readily available, low-cost emi shield and contact alternatives to custom designed solutions. yet, you can still expect custom attention in terms of high quality and service. we offer a variety of sizes and designs to choose from, so you can count on finding a product that will deliver the results your project requires. however, should your choice not fully fit your space requirement constraints, we can modify any one our standard designs. our standard shields and contacts are available in a wide range of material choices, and all allow for full solderability. standard shield offerings incorporate proprietary design criteria for maximum performance and are available in one-piece and two-piece designs. laird technologies? standard contacts base materials include beryllium-copper, phosphor bronze, nickel and stainless steel. they offer many plating options to allow for maximum electrical current carrying performance. front view 97-860 and 97-866 front view 97-870 typical mounting configuration side view flat cover 25 ft. (7,6 m) mounting pin standard strip solder tab spring finger .115 dia. (2,92) clearance .300 (7,62) .300 (7,62) .020 (0,51) 25 ft. (7,6 m) nominal cover thickness-any conductive material mount hole centerline c a b d e other heights and custom-designed cover configurations available. consult sales department. approx. length series a b c d e ft. (m) 97-860 .52 .045 .12 .03 .40 25 (13.2) (1.1) (3.2) (0.8) (10.2) (7.6) 97-866 .82 .045 .12 .03 .70 25 (20.8) (1.1) (3.2) (0.8) (17.8) (7.6) 97-870 1.12 .045 .12 .03 1.00 25 (28.4) (1.1) (3.2) (0.8) (25.4) (7.6) pc shield dimensions .200 (5,08) typ. printed circuit board shields 97-860 97-866 97-870 patent no. 4,754,101
maximum maximum carrier carrier part surface overall overall tape tape parts number area dimension height width pitch per reel weight bmis-201 .253 2 ( 163.10 2 ) .538 x .476 .100 (2.54 ) 24 mm 20 mm 1000 0.3 g (13.66 x 12.10 ) bmis-202 .402 2 ( 259.21 2 ) .650 x .650 .142 ( 3.60 ) 32 mm 24 mm 700 0.5 g ( 16.50 x 16.50 ) bmis-203 1.033 2 ( 666.16 2 ) 1.032 x 1.032 .200 ( 5.08 ) 44 mm 32 mm 300 1.0 g ( 26.21 x 26.21 ) bmis-204 1.548 2 ( 998.56 2 ) 1.260 x 1.260 .236 ( 6.00 ) 44 mm 36 mm 225 1.6 g ( 32.00 x 32.00 ) bmis-205 1.461 2 ( 942.50 2 ) 1.500 x 1.000 .236 ( 6.00 ) 56 mm 44 mm 250 1.6 g ( 38.10 x 25.40 ) bmis-206 1.879 2 ( 1212.39 2) 1.450 x 1.326 .200 ( 5.08 ) 56 mm 40 mm 300 1.5 g ( 36.83 x 33.68 ) bmis-207 2.997 2 ( 1933.36 2 ) 1.747 x 1.747 .384 ( 9.75 ) 56 mm 56 mm 120 3.2 g ( 44.37 x 44.37 ) bmis-210 2.080 2 (1342 2 ) 1.732 x 1.201 .118 (3.00) 56 mm 40 mm 450 1.0 g (44.02 x 30.50) maximum maximum carrier carrier part surface overall overall tape tape parts number area dimension height width pitch per reel weight bmis-101 .253 2 ( 163.10 2 ) .538 x .476 .100 (2.54 ) 24 mm 20 mm 1000 0.4 g (13.66 x 12.10 ) BMIS-102 .402 2 ( 259.21 2 ) .650 x .650 .142 ( 3.60 ) 32 mm 24 mm 700 0.7 g ( 16.50 x 16.50 ) bmis-103 1.033 2 ( 666.16 2 ) 1.032 x 1.032 .200 ( 5.08 ) 44 mm 32 mm 300 1.6 g ( 26.2 x 26.21 ) bmis-104 1.548 2 ( 998.56 2 ) 1.260 x 1.260 .236 ( 6.00 ) 44 mm 36 mm 225 2.4 g ( 32.00 x 32.00 ) bmis-105 1.461 2 ( 942.50 2 ) 1.500 x 1.000 .236 ( 6.00 ) 56 mm 32 mm 250 2.4 g ( 38.10 x 25.40 ) bmis-106 1.879 2 ( 1212.39 2 ) 1.450 x 1.326 .200 ( 5.08 ) 56 mm 40 mm 300 2.5 g ( 36.83 x 33.68 ) bmis-107 2.997 2 ( 1933.36 2 ) 1.747 x 1.747 .384 ( 9.75 ) 56 mm 56 mm 120 6.5 g ( 44.37 x 44.37 ) test property method result co-planarity ltwi-1119 < 0.10 mm solderability ansi/jstd-002 >99% solderability mil-std-202 method 208 >99% surface mount solderability ansi/eia 638 passes appearance lties-125 passes adhesion astm b-571 passes 3 axis mechanical shock ltes-461 passes pick-up spot material carrier tape diameter material thickness material 6 mm or greater 0.20 mm crs tin 0.20 mm ltims-lcb cover tape reel reel material diameter material packaging ltims-psa 330 mm (101, 102, 103, 104, plastic eia-481 201, 202, 203, 204) 381 mm (105, 106, 107, 205, 206, 207) standard design shields and contacts www.lairdtech.com 7 standard surface mount shields?one-piece off the shelf, on spec and on budget standard surface mount shields are available in both one-piece and two-piece designs. one-piece shields offer six sides of protection, with the sixth side being the board itself. one-piece designs offer economical shielding protection where access to covered components is not necessary. there are no tooling costs associated with either the one and/or two-piece design. standard surface mount shields?two-piece reduce board damage from inspection and repairs two-piece board level shields offer users the flexibility to inspect or repair shielded components without having to risk board damage by removing the entire shield or incur any tooling costs. covers snap on and off with ease, which makes repair of the component under the shield quicker and easier and reduces board re-work. two-piece shields are available unassembled*, and are designed to survive drop, shock and no-rattle tests. *pre-assembly is an option. consult sales. typical properties & performance ? all part numbers standard one-piece board level shields standard two-piece board level shields design parameters ? all part numbers all dimensions shown are in millimeters unless otherwise specified.
maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-201 .253 2 (163.10 2 ) .538 x .476 .100 (2.54) 24 mm 20 mm 1000 (13.66 x 12.10) maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-101 .253 2 (163.10 2 ) .538 x .476 .100 (2.54) 24 mm 20 mm 1000 (13.66 x 12.10) standard design shields and contacts www.lairdtech.com 8 all dimensions shown are in millimeters unless otherwise specified. standard surface mount shield one-piece part no. bmis-101 applications: works exceptionally well in small component areas 48 vqfp dimensions (mm) standard surface mount shield two-piece part no. bmis-201 applications: works exceptionally well in small component areas 48 vqfp dimensions (mm) design specifications design specifications footprint footprint carrier tape carrier tape
maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-202 .402 2 (259.21 2 ) .650 x .650 .142 (3.60) 32 mm 24 mm 700 (16.50 x 16.50) maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel BMIS-102 .402 2 (259.21 2 ) .650 x .650 .142 (3.60) 32 mm 24 mm 700 (16.50 x 16.50) standard design shields and contacts www.lairdtech.com 9 design specifications all dimensions shown are in millimeters unless otherwise specified. standard surface mount shield one-piece part no. BMIS-102 applications: 48 vqfp 44, 48 qfp dimensions (mm) standard surface mount shield two-piece part no. bmis-202 applications: 48 vqfp 44, 48 qfp dimensions (mm) design specifications footprint footprint carrier tape carrier tape
maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-203 1.033 2 (666.16 2 ) 1.032 x 1.032 .200 (5.08) 44 mm 32 mm 300 (26.21 x 26.21) maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-103 1.033 2 (666.16 2 ) 1.032 x 1.032 .200 (5.08) 44 mm 32 mm 300 (26.21 x 26.21) standard design shields and contacts www.lairdtech.com 10 standard surface mount shield one-piece part no. bmis-103 applications: 32, 44, 52 pin plcc 121, 169 bga 48, 100 vqfp 44, 48, 64, 80 qfp dimensions (mm) standard surface mount shield two-piece part no. bmis-203 applications: 32, 44, 52 pin plcc 121, 169 bga 48, 100 vqfp 44, 48, 64, 80 qfp dimensions (mm) design specifications design specifications footprint footprint all dimensions shown are in millimeters unless otherwise specified. carrier tape carrier tape
maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-204 1.548 2 (998.56 2 ) 1.260 x 1.260 .236 (6.00) 44 mm 36 mm 225 (32.00 x 32.00) maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-104 1.548 2 (998.56 2 ) 1.260 x 1.260 .236 (6.00) 44 mm 36 mm 225 (32.00 x 32.00) standard design shields and contacts www.lairdtech.com 11 standard surface mount shield one-piece part no. bmis-104 applications: 121, 169, 225 bga 32, 44, 52, 68 plcc 48, 100 vqfp 44, 48, 64, 80, 100 qfp dimensions (mm) standard surface mount shield two-piece part no. bmis-204 applications: 121, 169, 225 bga 32, 44, 52, 68 plcc 48, 100 vqfp 44, 48, 64, 80, 100 qfp design specifications design specifications footprint footprint dimensions (mm) all dimensions shown are in millimeters unless otherwise specified. carrier tape carrier tape
maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-205 1.461 2 (942.50 2 ) 1.500 x 1.000 .236 (6.00) 56 mm 44 mm 250 (38.10 x 25.40) maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-105 1.461 2 (942.50 2 ) 1.500 x 1.000 .236 (6.00) 56 mm 32 mm 250 (38.10 x 25.40) standard design shields and contacts www.lairdtech.com 12 standard surface mount shield one-piece part no. bmis-105 applications: 121 bga 32, 44, 52 plcc 48, 100 vqfp 44, 48, 64, 80, 100 qfp dimensions (mm) standard surface mount shield two-piece part no. bmis-205 applications: 121 bga 32, 44, 52 plcc 48, 100 vqfp 44, 48, 64, 80, 100 qfp dimensions (mm) design specifications design specifications footprint footprint all dimensions shown are in millimeters unless otherwise specified. carrier tape carrier tape
maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-206 1.879 2 (1212.39 2 ) 1.450 x 1.326 .200 (5.08) 56 mm 40 mm 300 (36.83 x 33.68) maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-106 1.879 2 (1212.39 2 ) 1.450 x 1.326 .200 (5.08) 56 mm 40 mm 300 (36.83 x 33.68) standard design shields and contacts www.lairdtech.com 13 standard surface mount shield one-piece part no. bmis-106 applications: 121, 169, 225 bga 32, 44, 52, 68 plcc 48, 100 vqfp 44, 48, 64, 80, 100 qfp dimensions (mm) standard surface mount shield two-piece part no. bmis-206 applications: 121, 169, 225 bga 32, 44, 52, 68 plcc 48, 100 vqfp 44, 48, 64, 80, 100 qfp dimensions (mm) design specifications design specifications footprint footprint all dimensions shown are in millimeters unless otherwise specified. carrier tape carrier tape
maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-107 2.997 2 (1933.36 2 ) 1.747 x 1.747 .384 (9.75) 56 mm 56 mm 120 (44.37 x 44.37) maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-207 2.997 2 (1933.36 2 ) 1.747 x 1.747 .384 (9.75) 56 mm 56 mm 120 (44.37 x 44.37) www.lairdtech.com 14 standard design shields and contacts standard surface mount shield one-piece part no. bmis-107 applications: supplied in 56 mm eia standard carrier tape 121, 169, 225, 313 bga 32, 44, 52, 68, 84 plcc 48, 100, 208 vqfp 44, 48, 64, 80, 100, 120, 160 qfp dimensions (mm) standard surface mount shield two-piece part no. bmis-207 dimensions (mm) design specifications design specifications applications: 121, 169, 225, 313 bga 32, 44, 52, 68, 84 plcc 48, 100, 208 vqfp 44, 48, 64, 80, 100, 120, 160 qfp footprint footprint all dimensions shown are in millimeters unless otherwise specified. carrier tape carrier tape
maximum maximum carrier carrier parts part surface overall overall tape tape per number area dimension height width pitch reel bmis-210 2.997 2 (1933.36 2 ) 1.732 x 1.201 .118 (3.00) 56 mm 56 mm 120 (44.00 x 30.50) www.lairdtech.com 15 standard design shields and contacts standard surface mount shield two-piece part no. bmis-210 design specifications dimensions (mm) all dimensions shown are in millimeters unless otherwise specified. footprint
ez peel shield replacement lid options part no. snap-in lid no. dish lid no. 97-2002 97-2007 97-2014 97-2003 97-2006 97-2013 97-2004 not available 97-2016 97-2005 97-2008 97-2015 standard design shields and contacts www.lairdtech.com 16 dish cover application ez peel ? standard shields for quick and easy access to board level components laird technologies offers four standard sizes of ez peel removable cover board level shields. these patented shields have a solid top, scored to allow peel-off when access to board level components within the shield is required. the peel-off feature prevents damage to the board and components by eliminating the need for labor intensive de-soldering, which can often result in increased scrap. peeling off the cover is accomplished by using a small starter hole for simple removal. this hand operation requires minimal force using a hook scriber or tweezers. after repair, replacement or adjustment of internal components, the shield can be resealed using a replacement cover. laird technologies offers two replacement cover options: a snap-in cover and a dish cover. the snap-in cover utilizes a lance and hole design. the replacement cover snaps into place and locks into a lance feature on the frame of the original shield. the other option is a dish cover that gets soldered into place on the board. the dish shape allows for self-location of the cover for soldering. all of our standard ez peel board level shields can be packaged in tape and reel formats for easy smt installation using conventional pick-and-place equipment. the four standard sizes are also available without the ez peel (scored) feature. easy removal of scored cover area only 1.5 lbs. force for cover removal simple replacement technique for cover used on surface mount or through-hole applications shield retains all physical properties after pcmcia/ jeida testing for shock, bending, torque, drop and vibration crs 1008/1010 (tin plated) for solderability snap-in cover application original ez peel board level shield ^ after removal of scored section and application of snap-in cover ^ after removal of scored section and application of dish cover table 1 all dimensions shown are in (inches) millimeters unless otherwise specified.
www.lairdtech.com 17 ez peel ? standard shields profiles/dimensions ez peel board level shields carrier tape 97-2003 97-2002 97-2005 97-2004 solder pad footprint all dimensions shown are in (inches) millimeters unless otherwise specified. standard design shields and contacts
available typical parts contacts material platings applications per reel bmic-004 0.10 mm becu nickel, gold grounding, energy carrying 1400 available typical parts contacts material platings applications per reel bmic-002 0.10 becu nickel, gold grounding, energy carrying 3500 available typical parts contacts material platings applications per reel bmic-001 0.10 mm becu nickel, tin, gold grounding, energy carrying 3000 available typical parts contacts material platings applications per reel bmic-001 0.10 mm becu nickel, tin, gold grounding, energy carrying 3000 bmic-002 0.10 mm becu nickel, gold grounding, energy carrying 3500 bmic-004 0.10 mm becu nickel, gold grounding, energy carrying 1400 bmic-006 0.10 mm becu tin grounding, energy carrying 3500 bmic-007-01 0.13 mm becu copper, tin grounding, energy carrying 2300 bmic-010-* 0.20 mm spring steel tin standoff, support 3500 www.lairdtech.com 18 standard design shields and contacts available typical parts contacts material platings applications per reel bmic-006 0.10 becu tin grounding, energy carrying 3500 material properties are for reference only. product testing by purchaser is recommended to confirm. laird technologies assumes no liability for product failure unless specifically stated in writing. standard precision electronic contacts laird technologies? standard precision electronic contacts ground, carry current and signals, and interconnect boards and devices. we offer a wide choice of plating options to allow for the maximum electrical current carrying performance. we have a wide array of designs in standard format that are ready for production. installed costs are lowered with our tape and reel. typ 1.27 3.1 typ 17 3.11 2.03 typ ro.43 typ typ ro.19 typ 0.51 2.46 2.44 1.78 5.97 5.18 30.000 2.08 part no. bmic-001 standard precision electronic contacts material variations part no. bmic-004 part no. bmic-002 part no. bmic-006 side view front view right side 4.31 1.52 5.18 r .74 3.81 see detail a side view front view top view front view right side top view detail a typical deflection behavior of bmic-001, bmic-004, bmic-006, and bmic-007-01 all dimensions shown are in millimeters unless otherwise specified.
dimensions millimeters (inches) part number bls type length width height lt-bls-209 two piece 29.36 (1.156) 18.50 (0.728) 7.00 (0.276) lt-bls-215 two piece 33.02 (1.300) 27.05 (1.065) 10.16 (0.400) lt-bls-224 two piece 41.91 (1.650) 34.93 (1.375) 10.16 (0.400) lt-bls-216 two piece 44.96 (1.770) 27.05 (1.065) 10.16 (0.400) lt-bls-213 two piece 54.10 (2.130) 27.05 (1.065) 10.16 (0.400) lt-bls-225 two piece 57.15 (2.250) 34.93 (1.375) 10.16 (0.400) lt-bls-219 two piece 70.00 (2.756) 56.90 (2.240) 10.16 (0.400) lt-bls-229 two piece 70.49 (2.775) 42.80 (1.685) 10.16 (0.400) lt-bls-226 two piece 71.12 (2.800) 34.93 (1.375) 10.16 (0.400) lt-bls-227 two piece 85.73 (3.375) 34.93 (1.375) 10.16 (0.400) dimensions millimeters (inches) part number bls type length width height lt-bls-109 1 piece bls 5.08 (0.200) 3.05 (0.120) 1.52 (0.060) lt-bls-139 1 piece bls 18.70 (0.736) 14.60 (0.575) 6.00 (0.236) lt-bls-137 1 piece bls 30.30 (1.193) 14.80 (0.583) 6.00 (0.236) lt-bls-138 1 piece bls 30.30 (1.193) 24.40 (0.961) 6.00 (0.236) lt-bls-141 1 piece bls 34.20 (1.346) 14.60 (0.575) 6.00 (0.236) lt-bls-136 1 piece bls 36.40 (1.433) 17.40 (0.685) 6.00 (0.236) lt-bls-143 1 piece bls 39.40 (1.551) 35.30 (1.390) 6.00 (0.236) available typical parts contacts material platings applications per reel bmic-010-* 0.20 mm spring steel tin standoff, support 3500 www.lairdtech.com 19 available typical parts contacts material platings applications per reel bmic-007-01 0.13 mm becu copper, tin grounding, energy carrying 2300 1.45 0.05 ro .30 1.27 a part no. bmic-007-01 part no. bmic-010-* standard design shields and contacts on two piece bls, dimensions shown are the exterior frame dimensions. one piece two piece standard prototype parts standard prototype parts are available in select one piece and two-piece sizes with no tooling fees. parts are manufactured in our prototype department to production tolerances with lead times typically less than two weeks. shields are made from high quality steel for excellent shielding performance across a wide frequency range. the tin plated surface provides excellent solderability and compatibility with lead-free processes. upon request, part drawings and solder pad layouts are available. 2.30 3.20 1.40 2.30 3.30 ro.55x2 inside 1.50 ro.10 typ inside 1.00 top view right side front view front view b ab * 1 1.8 2.5 2 5.0 15.0 3 4.0 8.0 side view all dimensions shown are in millimeters unless otherwise specified. standard design shields and contacts
thickness raw material* in (mm) heat treatment plating comments crs base box steel .005 to .090 no heat treatment tin pre-plated 1008/1010 (0.127 to 2.286) beryllium-copper .004 to .008 heat treatable tin, palladium, pre-tempered alloys (0.102 to 0.203) in all tempers nickel, gold & pre-plated nickel-silver alloys .004 to .016 stress annealed fully solderable no plating required (0.127 to 0.406) (if used with lt for smt solderability proprietary process) copper-based alloys .004 to .012 no heat treatment tin, palladium, pre-tempered (0.102 to 0.305) nickel, gold & pre-plated spring steel .006 to .060 austemper tin, nickel, spring properties (0.152 to 1.524) black oxide determined by application shield-lite? 0.005 n/a 1.25-5.00mm fully (0.13) 100% matte tin solderable phosphor bronze alloys 004 to .020 n/a tin, palladium pre-tempered & (0.10 to 0.51) nickel, gold pre-plated www.lairdtech.com 20 introduction the complexities of today?s electronics pose several design challenges. resolving emi needs to be balanced with space, weight and production restraints. when designing a custom shielding solution, beginning in the earliest stages of the application design allows you to effectively eliminate emi and meet all specifications. laird technologies board level shielding experts work with you through all phases of development. from design, rapid prototyping and pre-production through production and automated packaging, we have the experience to help speed your product to market and within budget. to increase manufacturing throughput and reduce costs, we have developed a proprietary in-line production process that includes part formation, wash, assembly, inspection and automated packaging. by integrating quality processes, we ensure board level shield quality and performance from the part design stage through final packaging. one such process is our automated co-planarity inspection system. we replicate the customer application by measuring shields in the same plane as the printed circuit board. this is accomplished without ?securing? or ?touching? shields, which could throw off measurement and/or deform parts. we measure shields immediately prior to placement into carrier tape at speeds that match automation packing. shield base materials include our exclusive shield-lite ? , crs 1008/1010, beryllium-copper alloys, nickel-silver alloys, copper-based alloys and spring steels. all shields are fully solderable. one-piece shield design low cost/excellent effectiveness custom surface mount shields are available in both one-piece and two-piece designs. one-piece shields provide six sides of protection, with the sixth side being the board itself. one-piece designs offer economical shielding alternatives where access to covered components for repair is not necessary. for our standard one-piece shields see pages 8-14. two-piece shield design quick, easy repair and inspection of covered components two-piece board level shields offer users the flexibility to inspect or repair shielded components without having to risk board damage by removing the entire shield. covers snap on and off with ease, making repairs quicker and easier, and reducing board re-work. two-piece shields are available pre-assembled or unassembled. for our standard two-piece shields see pages 8-15. large locking dimples snap into slots on covers to provide mechanical retention force. smaller grounding dimples provide electrical grounding for proper shielding and to prevent rattle. we have designed our two-piece shields to survive drop, shock and no-rattle tests. here are critical test results: able to withstand acceleration of 4g from 10 hz to 2000 hz for three hours in each of three planes as per sae j1455 passed en 50 155 for railway electrical equipment including vibration test of 30g from 5 hz to 200 hz in 3 directions and a shock test with 500 m/s for 11 ms passed standard telecommunications drop tests [6 faces, dropped 1 meter onto concrete floor] *other materials may be available, please consult sales. material properties are for reference only. product testing by purchaser is recommended to confirm. laird technologies assumes no liability for product failure unless specifically stated in writing. surface mount shields material variations all dimensions shown are in inches (millimeters) unless otherwise specified. custom design shields and contacts
available material thickness electrical: dialectric coating corrosion breakdown strength aging resistance humidity 15 - 30 microns survives quv uvb test astm b-117 >1500 hours survives 85%/85c >250v/mil astm g-85 >600 hours humidity >100 hours without degradation pencil hardness reflow color adhesion (astm d-3363) no degradation during reflow 16 colors (black is standard) passes astm b-571 astm d-3363: 4h design service abrasion availability temperature astmd-4060: one-piece -73c to 205c 2.2mg wght loss/1000 cycles two-piece astmd-2714: multi-compartmental 125,000 cycles astmd-2714: 0.07 material available core material density material gauge material solderability lt-bls-shield-lite 3.3 g/cc (58% lighter 0.13 - 1.38 mm aluminum ansi / j std-002: pass than standard material) ansi / eia 638: pass solderable plating electrical thermal material thickness adhesion conductivity conductivity 100% matte tin 2.5 - 5.0 microns passes astm b-571 >45% iacs 190 w/m-k (4 times more conductive (2.9 times more than than standard material) standard material? 192% improvement) design tensile yield availability strength strength elongation one-piece 227-277 mpa 206-262 mpa 1-3% ez peel (33-40 ksi) (30-38 ksi) custom design shields and contacts www.lairdtech.com 21 insulshield ? reduce the cost of protecting components because emi shields are made of conductive materials, there is the possibility that they could short-circuit other board components. traditionally, protective polyester tapes or polyimide films have been used to isolate shields. however, these methods add steps and additional expense to the production process, which results in higher costs and added production time. laird technologies? exclusive insulshield, available in one-piece, two-piece or multi-compartmental shields, o ffers a better alternative. the coating used is 15 ? 30 m thick, which is thinner than isolating tapes, therefore req uiring less space. eliminating tapes also means fewer production steps and lower inventory costs. insulshield offers excellent aging properties and abrasion resistance. this leads to a longer life of your end product. insulshield meets several astm standards including astm d-523, d-3363, d-4060, d-2714, b-117, g-85, d-2510a and d-2510c. insulshield is fully compatible with standard re-flow processes. material properties are for reference only. product testing by purchaser is recommended to confirm. laird technologies assumes no liability for product failure unless specifically stated in writing. insulshield design parameters ez peel ? shield design economical access for low incidences of repairs in cases where there is a low incidence of repairable circuit defects, you may need to access shielded components. an economical solution is our line of ez peel shields. these one-piece shields feature an easy-to-remove top section that can be peeled back using simple tools for access to components. built-in flexibility controls the ease of removing the top, and our robust design delivers superior flatness. ez peel shields are designed to accept a snap-on cover in the same manner as our two-piece shields, following circuit repair. for our standard ez peel products see pages 16-17. multi-compartmental shield design shield multiple ciruit groups?save pcb space and production time printed circuit boards with multiple circuit groups pose unique design challenges. shielding these groups separately adversely affects circuit board real estate and increases part count. our multi-compartmental shields allow you to replace three or more single shields with one shield divided into several walled compartments. installing a single part reduces part count, along with production time through faster pick-and-place speeds. this allows you to reduce the number of parts you carry in inventory, which lowers your overhead costs. multi-compartmental shields feature internal dividing walls of one material thickness and meet all on-board shield requirements for fcc, vde, cispr and ce. they are available in two-piece designs, either assembled or unassembled. our unassembled versions allow for automatic optical inspection prior to cover placement. as in all our shielding offerings, laird technologies? proprietary process for 100% automatic optical inspection verifies co-planarity?including inner walls. shield-lite ? lightweight, solderable shielding solution laird technologies? shield-lite is the lightest-weight shielding solution on the market. our proprietary engineered aluminum-based alloy weighs less than 50% of conventional materials, yet delivers enhanced shielding performance. shield-lite is fully solderable and will not warp during re-flow. the thermal conductivity of shield-lite delivers a 192% improvement over steel. the increased thermal conductivity allows heat to be more efficiently transferred to the solder pad trace during the re-flow process. additionally, heat generated by shielded devices is more effectively dispersed, allowing operation at faster clock speeds. shield-lite is available in one-piece or ez peel configurations for any application where light weight is critical. material properties are for reference only. product testing by purchaser is recommended to confirm. laird technologies assumes no liability for product failure unless specifically stated in writing. shield-lite design parameters
www.lairdtech.com 22 custom design shields and contacts drawn board level shields seamless corners address high-frequency leakage as microprocessor speeds continue to increase, so does the potential for emi leakage through the smallest apertures in board level shields. laird technologies? drawn board level shields are designed to provide additional near-field and far-field circuit isolation (attenuation) at higher frequencies by eliminating the apertures found in the corners of traditional board level solutions. drawn board level shields utilize small ground trace sizes, thereby preserving space on the circuit board. solid corner designs when additional circuit isolation (attenuation) is required at higher frequencies available in heights up to .250" (6.4 mm) with length and width dimensions from .300" (7.6 mm) to 2.0" (50.8 mm) tape and reel packaging provides an economical and automated smt attachment method available in cold rolled steel, brass, stainless steel and nickel silver mold-in-place and form-in-place elastomers can be combined with drawn board level shields to achieve shielding of multiple components with a single part available with an ez peel ? scored cover feature; allows for easy top section removal for component repair and re-sealing ventilation holes as needed for solder outgassing. all dimensions shown are in inches (millimeters) unless otherwise specified. ^ the receive antenna test region from 1 ghz to 10 ghz that defines the far-field and near-field is 2.0" and 0.190", respectfully, from the transmit antenna. this test is performed for worst case orientation. circuit isolation is a measurement that defines the resultant attenuation level in db provided by a pcb shield from an initial reference level as defined in laird test procedure pda-pro- 027. series 97-2100 notice: the data set forth in all text, tables, charts, graphs and figures herein are based on samples tested and are not guaranteed for all samp les or app lications. such data are intended as guides and do not reflect product specification for any specific part.
www.lairdtech.com 23 custom design shields and contacts dyna-form laird technologies remains at the forefront of stamping technology. we offer innovative solutions for board level shields [bls]. our two piece bls design allows convenient access when the enclosed circuitry must be repaired. covers snap on and off with ease, which makes repair of the component under the shield quicker and easier. previously, two pieces of the bls assembly [frame and lid] were assembled with specialized automation equipment. dyna-form eliminates the need for specialized automation equipment. the parts are formed and assembled in one dynamic operation using the latest stamping technology. the need for supporting ribs on the frame is eliminated. each custom designed solution can be specifically tailored to specific circuitry geometry. dyna-form advantages lowers overall tooling cost by eliminating the need for specialized automation tooling. reduces lead time by eliminating the need for specialized automation tooling. improved lid retention forces. improved time to market. reduces required pcb space because there is no gap between frame and cover. increased access, no cross bars needed. notes
thickness type in (mm) heat treatment plating / coating comments beryllium copper alloys: .0035 to .080 heat treatable tin, palladium, nickel, gold, silver heat treated as necessary. 17200, 190, 290, 174 (0.089 to 2.03) pre-plated or post-plated phosphor bronze alloys: .004 to .090 n/a tin, palladium, nickel, gold, silver pre-plated or post-plated 510, 505, 511, 521, 544 (0.10 to 2.29) copper alloys: .006 to .125 n/a tin, palladium, nickel, gold, silver pre-plated or post-plated 110, 102, 122, 1093 (0.15 to 3.18) brass alloys: .004 to .090 n/a tin, palladium, nickel, gold, silver pre-plated or post-plated 260, 210, 220, 226, 230, (0.10 to 2.29) 240, 268, 350, 353 nickel silver alloys: .004 to .060 n/a tin, palladium, nickel, gold, silver solderable in unplated condition 770, 752, 762 (0.10 to 1.52) (if used with lt proprietary process) spring steel alloys: .008 to .080 austemper tin, nickel, black oxide plated after heat treatment. 1050, 1065, 1074, 1095 (0.20 to 2.03) stainless steel alloys: .004 to .090 n/a tin, gold pre-plated or post-plated 301, 302, 305, 316, 201, 202 (0.10 to 2.29) stainless steel alloys: .004 to .090 heat treatable tin, gold heat treated as necessary. 410, 420 (0.10 to 2.29) pre-plated or post-plated titanium copper .004 to .012 n/a tin, palladium, nickel, gold, silver heat treated as necessary. (0.10 to 0.30) pre-plated or post-plated special alloys: clad metals .0035 to .080 n/a tin, palladium, nickel, gold, silver, pre-plated or post-plated (0.089 to 2.03) palladium-silver post plating thickness as required n/a tin, nickel, gold, silver, zinc, n/a black oxide, black zinc, phosphate www.lairdtech.com 24 custom precision electronic contacts gain maximum electrical and carrying performance from concept to placement, laird technologies has the expertise to deliver custom precision surface mount contacts. using the latest computer simulation techniques, we provide properly designed contacts that ground, carry current and signals, and interconnect boards and devices. we do this by using basic geometric parameters (length, width, uncompressed height, compressed height, contact force) to conduct finite element analysis (fea) on your prospective design. with the fea results, we can then identify the best design to optimize your product's operational performance. we also incorporate features to provide for placement and soldering of the contact onto the circuit board. laird technologies offers a wide range of plating options to allow for maximum electrical current carrying performance. we have exclusive processes such as our innovative mako process, which selectively plates contacts with precious metals only in the necessary areas. this eliminates bare edges and reduces costs. our automated packaging allows for complex and small designs with lower installed costs. contact base materials include beryllium-copper, phosphor bronze, nickel and stainless steel. all contacts are fully solderable as required. all dimensions shown are in inches (millimeters) unless otherwise specified. additional material choices are available upon request. material properties are for reference only. product testing by purchaser is recommended to confirm. laird technologies assumes no liability for product failure unless specifically stated in writing. custom precision electronic contacts material variations custom design shields and contacts
www.lairdtech.com 25 notes
north america our usa toll-free telephone number is +1.800.843.4556 delaware water gap, usa p.o. box 650 shielding way delaware water gap, pa 18327 phone +1.570.424.8510 fax +1.570.424.6213 st. louis, usa 3481 rider trail south st. louis, mo 63045 phone +1.314.344.9300 fax +1.314.344.9333 san jose, usa 2030 fortune drive suite 100 san jose, ca 95131 phone +1.408.544.9500 fax +1.408.577.0691 san marcos, usa 1825 diamond st. san marcos, ca 92069 phone +1.760.736.7007 fax +1.760.736.7008 schaumburg, usa 1751 wilkening ct. schaumburg, il 60173 phone +1.847.839.6000 fax +1.847.519.9682 europe rosenheim, germany ?u?ere oberaustra?e 22 83026 rosenheim, germany phone +49.8031.24600 fax +49.8031.246050 france 13-15 rue des entrepreneurs 91560 crosne, france phone +33.1.69.49.79.79 fax +33.1.69.49.79.80 czech republic prumyslova 497 462 11 liberec czech republic phone +420.488.575.111 fax +420.488.575.303 united kingdom warner drive springwood industrial estate braintree essex cm7 2yw phone +44.1376.342626 fax +44.1376.346442 asia taiwan 4f, no. 6, hou-sheng rd. luchu, taoyuan, taiwan 338 phone +886.3.312.9292 fax +886.3.312.9090 japan shin yokohama business center building 7f 2-6, shin yokohama 3-chome, kohoku-ku, yokohama-shi, kanagawa 222-0033, japan phone +81.45.473.6808 fax +81.45.473.6162 2-12-8 sachiura,kanazawa-ku yokohama-shi 236-0003, japan phone +81.457.851063 fax +81.457.851064 shenzhen, china no. 2 building, 2nd industry park, tangxiayong songgang town, baoan district, shenzhen city, guangdong province, china 518105 phone +86.755.271.41166 fax +86.755.271.41199 tianjin, china building b, fenghua industrial park, 66 on the ninth avenue, teda, tianjin, p.r. china 300457 phone +86.22.6629.8160 fax +86.22.6629.8158 shanghai, china building 1, number 58 hua ning road, lane 4018 shanghai, p.r. china 201108 phone +86.21.6442.8018 fax +86.21.6489.6055 suzhou, china room 408, 4th floor, suzhou tohkin plaza, 889 ganjiang road, suzhou city, jiangsu province, p.r. china 215002 phone +86.512.651.51368 fax +86.512.651.56878 singapore 750e chai chee road #03-07/08 technopark@chai chee singapore 469005 phone +65.6243.8022 fax +65.6243.8021 korea 2nd floor, hwasung bldg. 34-2 chunho-dong, kangdong-ku, seoul, korea phone +82.2477.1390 fax +82.2477.1393 notice: although the information and recommendations set forth herein (hereinafter ?information?) are presented in good faith and believed to be correct as of the date hereof, laird technologies makes no representation or warranties as to the completeness or accuracy thereof. information is supplied upon the condition that the persons receiving same will make their own determination as to its suitability for their purposes prior to use. in no event will laird technologies be responsible for damages of any nature whatsoever resulting from the use or reliance upon information or the product to which information refers. nothing contained herein is to be construed as a recommendation to use any product, process, equipment or formulation in conflict with any patent, and laird technologies makes no representation or warranty, expressed or implied, that the use thereof will not infringe any patent. the data set forth in all tables, charts, graphs and figures herein are based on samples tested and are not guaranteed for all samples or applications. such data are intended as guides and do not reflect product specifications for any particular product. no representation or warranties, either expressed or implied, or merchantability, fitness for a particular purpose or of any other nature are made hereunder with respect to information or the product to which information refers. ez peel ? is a trademark of laird technologies. ? 2004 laird technologies? 7500m 06/04 1.800.843.4556 | www.lairdtech.com | north america | europe | asia board level sheilds fingerstock fabric-over-foam form-in-place conductive elastomers microwave absorbers wire mesh

▲Up To Search▲

Price & Availability of BMIS-102

	To Download BMIS-102 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .